Semiconductor Design for Added Functionalities
The complexity of the design of semiconductors is bringing new challenges
for the industry.
With chiplets, removing the black packaging brings in additional issues with labelling. In addition, the chip design on a chip or 2D design was usually produced in one FAB in a fully integrated design. Today, the components of a chiplets are sourced from multiple FABs and the traceability of each components is becoming even more difficult.