Digitho provides die level traceability solution at the wafer level. This ensures continuous traceability of semiconductors along with the supply chain and the life cycle of a semiconductor.

Today's semiconductors have an ever more prominent role in functional safety. Current semiconductors are more complex and less mature than semiconductors used in vehicles 5 to 10 years ago. The use of SoC is also adding to the complexity as multiple subcomponents from multiple supply chains are packaged together.

The current best-in-class traceability process uses packaging marking based on sequence and data for each wafer; once the wafer is diced, this process is an improvement to the previous lot traceability processes commonly used in the industry.

Digitho's solution is designed around SEMI T2-9298E Standards.