The Automotive Industry has multiple rigorous standards for quality management. The use of 2D code has been generalized in the industry, and Unit Level Traceability is a fact for most components in a vehicle assembly.

The challenges come from electronics. First, the supply chain's complexity and design constraints limit the traceability to the Batch or Lot level.

The lack of Unit Level Traceability results in the absence of the ability of the supply chain to narrow down any recalls based on semiconductor failure.

Digitho provides die-level labelling and traceability at the wafer level with the dir X & Y Position information.

Due to the requirement of the Automotive industry, some OSAT (companies packaging the semiconductors) have moved toward providing packaging-level labelling on the packaged microchip. Still, unfortunately, this does not always guarantee accurate information due to the number of steps required in turning wafers into multiple semiconductors. As a result, the data is regularly lost.

This ensures the continuous traceability of semiconductors along with the supply chain and the life cycle of a semiconductor. Today's semiconductors have an ever more prominent role in functional safety. Current semiconductors are more complex and less mature than semiconductors used in vehicles 5 to 10 years ago. The use of SoC also adds to the complexity as multiple subcomponents from multiple supply chains are packaged together.