Traceability at the die level
Digitho provides die level traceability solution at the wafer level. This ensures continuous traceability of semiconductors along with the supply chain and the life cycle of a semiconductor.
Today's semiconductors have an ever more prominent role in functional safety. Current semiconductors are more complex and less mature than semiconductors used in vehicles 5 to 10 years ago. The use of SoC is also adding to the complexity as multiple subcomponents from multiple supply chains are packaged together.
The current best-in-class traceability process uses packaging marking based on sequence and data for each wafer; once the wafer is diced, this process is an improvement to the previous lot traceability processes commonly used in the industry.
Digitho's solution is designed around SEMI T2-9298E Standards.
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Digitho Technologies Inc
Bromont QC Canada
Digitho is a partner of:
ISEQ, ACET, NEXTAI, Investissement Quebec, PARI CNRC, C2MI